WAFER BONDING METHOD USING REACTIVE FOILS FOR MASSIVELY PARALLEL MICRO-ELECTROMECHANICAL SYSTEMS PACKAGING

摘要

PROBLEM TO BE SOLVED: To provide a wafer bonding method without exposing a MEMS (Micro-electromechanical systems) device and an IC to high temperature and high voltage. SOLUTION: The method for forming device packages includes steps of: forming an outer periphery 17 comprising a reactive foil 16 and a bonding material interposed between a first wafer 12 and a second wafer 14; pressing the first and the second wafers against the reactive foil and the bonding material; initiating the reaction of the reactive foil wherein the reactive foil heating the bonding material to create a bond between the first and the second wafers; and dividing the first and the second wafers into the device packages. COPYRIGHT: (C)2005,JPO&NCIPI