| 摘要 |
A placing device and a method for placing objects onto substrates are suited for obtaining both very small as well as very large placement forces of the object exerted on the substrate. To this end, a gripper, by way of which the object can be picked up, is pretensioned with regard to a holder in a direction of placement. The pretensioning ensues via a first coupling element provided on the holder and via a second coupling element provided on the gripper. An electrical and/or magnetic field is generated between the first and the second coupling element and effects an action of force between the holder and the gripper. This enables a predetermined placement force to be attained when using the gripper to place the object.
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