| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a combined ceramic sintered compact which is provided with a 1st phase and a 2nd phase, free from the occurrence of peeling between the phases or crack and used as an excellent member for semiconductor manufacture or the like. <P>SOLUTION: The thickness TA of the 1st phase of the combined ceramic sintered compact is thicker than thickness TB of the 2nd phase and the combined sintered compact is controlled so that ≥80% of the particles constituting the 1st phase has 0.2-3 μm particle diameter and ≥80% of the particles constituting the 2nd phase has 0.3-3 μm particle diameter. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
