| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a reticle which can reduce a strain generated on a pattern on the reticle at designing time and after its manufacture caused by reversing upside down at the reticle manufacturing time and using time. <P>SOLUTION: The method for manufacturing the reticle includes a step of first manufacturing an SOI wafer 102(A). The method further includes a step of coating a resist 105 on a lower surface in Fig. of a silicon layer 101, and patterning this resist 105(B). The method also includes a step of etching the silicon layer 101 from a lower side of Fig. by using an ICP dry etching (C). Then, the method includes a step of removing a silicon oxide layer 103 in a recess part 46 between struts by using a hydrofluoric acid. Thereafter, the method also includes a step of removing the resist 105(D). Then, the method also includes a step of then coating an EB resist 107 on a surface of the side of a recess 46 between the struts by a resist spray coating unit (E). The method also includes a step of forming a pattern by using an EB direct writing machine on this EB resist 107 while aligning by using a mark 108(F). Thereafter, the method includes a step of forming a stencil pattern by transferring the pattern of the EB resist 107 to a silicon membrane 41, and removing the EB resist 107(G). <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
