RADIOCOMMUNICATION MODULE ON A SUBSTRATE HAVING A SURFACE AREA GREATER THAN THAT OF THE ENCAPSULATION CASE THEREOF, AND CORRESPONDING RADIOCOMMUNICATION DEVICE AND PLATFORM

摘要

The invention relates to a radiocommunication module combining a set of components (121, 122) in an encapsulation case (12), said components being mounted on a substrate (11). The aforementioned substrate (11) is equipped with means (14) for mounting same to a printed circuit board. Moreover, the surface of the substrate is greater than that defined by the case (12) and bears a set of tracks and/or access points, such as to define a mounting land which is used to receive at least one other component (31, 32, 33) and/or to enable testing of the case. In addition, the substrate bears means (14) for positioning same on a printed circuit board such that the substrate can also be interconnected to said printed circuit board.