| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flexible circuit board incorporating a multilayer component in which highly reliable electrical connection can be realized with shortest distance and low resistance while facilitating lamination, and to provide its producing process. <P>SOLUTION: The flexible circuit board comprises a wiring layer 2 having an electrode part 3 formed of a conductor, a sheet-like insulating substrate 1 provided with via holes 5 or through holes 4 at a part of the wiring layer 2 and at a specified position of the electrode part 3, and one or more passive elements 8, e.g. a capacitor 10, a coil 11 and a resistor 12, or active elements, e.g. BGA type LSIs 13, mounted on the wiring layer 2 while being connected electrically therewith wherein the via holes 5 or through holes 4 are filled with solder 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
