| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding apparatus in which warpage of a chamber plate caused by the pressure difference between a high vacuum chamber and a low vacuum chamber is prevented. SOLUTION: The substrate bonding apparatus is constructed by including an upper low vacuum chamber, a lower low vacuum chamber, a sealing member to be brought into contact with an upper chamber plate to form a high vacuum chamber therein by being mounted so as to project along the top surface of a lower chamber plate at a predetermined height, at least two through holes formed in each of the upper chamber plate and the lower chamber plate, at least two open-close means to open and close each of the through holes, a vacuum pumping means to reduce pressures of the respective low vacuum chamber and the high vacuum chamber to low vacuum state and to a high vacuum state, respectively, and upper and lower stages provided to the upper and lower chamber plates, respectively, within an inside space of the high vacuum chamber to fix the respective substrates. COPYRIGHT: (C)2005,JPO&NCIPI
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