| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a layered ceramic electronic component wherein the position precision of internal electrodes is improved effectively and a fault, such as interlayer delamination, is hardly caused even in a case that thickness of a ceramic green sheet becomes small and the number of layers increases. SOLUTION: In the method for manufacturing a layered ceramic electronic component wherein the ceramic green sheets 3, 4 in which internal electrode patterns are formed are prepared, every one sheet or every several sheets of the ceramic green sheets 3, 4 are arranged on a stage 2 and subjected to heat compression bonding, layering is performed, and a base is obtained, the heat compression bonding is performed so that 10P2>P1>P2 is established when pressure applied to peripheral parts of the ceramic green sheets 3, 4 of one sheet or several sheets is made P1 and pressure applied to interior regions inside the peripheral parts is made P2. COPYRIGHT: (C)2005,JPO&NCIPI
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