发明名称 |
Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same |
摘要 |
A semiconductor package substrate and a method for fabricating the same are proposed. An insulating layer has a plurality of blind vias to expose inner traces underneath the insulating layer. A conductive film is formed on the insulating layer and over the bind vias. A first resist is formed on the conductive film, having openings to expose parts of the conductive film. A patterned trace layer including a plurality of contact pads is formed in the openings and the blind vias to form conductive vias, with at least one contact pad electrically connected to one conductive via. A second resist is formed on the patterned trace layer without covering the contact pads. A metal barrier layer is formed on the contact pads. Finally, the first and second resists and parts of the conductive film covered the first resist are removed.
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申请公布号 |
US2005037601(A1) |
申请公布日期 |
2005.02.17 |
申请号 |
US20030695356 |
申请日期 |
2003.10.27 |
申请人 |
HSU SHIH-PING;TSAI KUN-CHEN |
发明人 |
HSU SHIH-PING;TSAI KUN-CHEN |
分类号 |
H01L21/60;H01L21/48;H01L23/498;H05K3/10;H05K3/24;H05K3/28;H05K3/42;(IPC1-7):H01L21/44;H01L21/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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