发明名称 Cathodic sputtering apparatus
摘要 The invention relates to a cathodic sputtering apparatus (8) for coating substrates (17) in a vacuum, comprising an essentially tubular support for the material to be sputtered (2) which is rotatable about its longitudinal axis, a cooling system which is suitable for circulating a cooling medium in the tubular support (2) in conjunction with a cooling device external to the support (2), a device for connecting to an electrical power circuit, and a device for the rotary drive of the tubular support about its longitudinal axis. This apparatus also is provided with a magnet system which extends along the axis for the magnetic confinement of a plasma which is provided near a target made of the material to be sputtered, the magnet system being composed of pole shoes (9, 10), magnet yokes (12, 13) made of magnetically permeable metal, and magnetization means (5) which are suitable for generating a magnetic flux in the magnet system. The magnet poles of one polarity in the magnet system are situated outside the tubular target support (2) and enclose same in a frame-like manner, and the opposite magnetic poles are provided in the tubular, rotatable target support (2).
申请公布号 US2005034981(A1) 申请公布日期 2005.02.17
申请号 US20040851998 申请日期 2004.05.20
申请人 FUCHS FRANK;BANGERT STEFAN;LINDENBERG RALPH;GRIMM HELMUT;STOLLEY TOBIAS;SCHUSSLER UWE 发明人 FUCHS FRANK;BANGERT STEFAN;LINDENBERG RALPH;GRIMM HELMUT;STOLLEY TOBIAS;SCHUSSLER UWE
分类号 C23C14/35;C23C14/00;C23C14/34;H01J37/34;(IPC1-7):C23C14/00 主分类号 C23C14/35
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