发明名称 Semiconductor device having a random grained polysilicon layer and a method for its manufacture
摘要 A semiconductor device having a random grained polysilicon layer and a method for its manufacture are provided. In one example, the device includes a semiconductor substrate and an insulator layer on the substrate. A first polysilicon layer having a random grained structure is positioned above the insulator layer, a semiconductor alloy layer is positioned above the first polysilicon layer, and a second polysilicon layer is positioned above the semiconductor alloy layer.
申请公布号 US2005037555(A1) 申请公布日期 2005.02.17
申请号 US20040870878 申请日期 2004.06.17
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHEN CHIA-LIN;YAO LIANG-GI;CHEN SHIH-CHANG
分类号 H01L21/28;H01L29/49;(IPC1-7):H01L21/76 主分类号 H01L21/28
代理机构 代理人
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