| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method capable of stably obtaining a desired polishing quantity when a polishing object such as a semiconductor wafer is continuously polished. <P>SOLUTION: The polishing method for polishing a polishing object W by sliding the object W on a polishing surface 10 of a polishing table 11 comprises the steps of dressing the polishing surface 10 with feeding a dressing liquid to the polishing surface 10, increasing the rotating speed of the polishing table 11 to remove the excessive dressing liquid remaining on the polishing surface 10 after the feed of the dressing liquid is stopped, and polishing the polishing object W with feeding the polishing liquid to the polishing surface 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
