| 摘要 |
PROBLEM TO BE SOLVED: To provide a clamp ring which can press a wafer more uniformly and prevents the sticking of film deposition particles, and to provide semiconductor manufacturing equipment and a method of manufacturing a semiconductor device. SOLUTION: The clamp ring 10 presses a peripheral edge of the wafer Waf placed on a table S. The inside 11 of the clamp ring 10 is extended above the peripheral edge of the wafer Waf. The inside 11 is formed into a multilevel configuration 12 to form an appropriate gap with the peripheral edge of the wafer Waf. One end of a urging member 13 is fixed to a step 121 of the multilevel configuration 12 which is closest to the peripheral edge of the wafer Waf, while the other end protrudes on the step 122 side. The pressure member 13 consists, for example, of a rectangular flat spring, and one end thereof is fixed with a pin, a screw, or the like. A plurality of such pressure members 13 are installed with equal intervals in the inside 11. COPYRIGHT: (C)2005,JPO&NCIPI |
