| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing multilayered wiring board with built-in passive element by which the productivity of a multilayered printed wiring board with a built-in passive element can be improved by shortening the laser beam machining time at the time of forming an opening for forming the passive element by laser beam machining. <P>SOLUTION: The method of manufacturing the multilayered printed wiring board with the built-in passive element includes a step of forming a lower electrode 31a for passive element at least at a prescribed position of a circuit board 50, a step of forming a resin layer 51 having a weak alkali resistance on the lower electrode 31a, and a step of forming an insulating layer 61. The method also includes a step of forming the opening 62 by punching the insulating film 61 formed on the lower electrode 31a, a step of forming a dielectric layer 71 in the opening 62, and a step of forming the passive element 80 by forming an upper electrode 81 for passive element on the dielectric layer 71. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
