| 摘要 |
PROBLEM TO BE SOLVED: To provide a lift-off method for stably forming a pattern having substantially no burr and an apparatus therefor, in relation to a lift-off method for a semiconductor substrate, on a surface of which an evaporated metal film to be removed is formed via a resist, and a lift-off apparatus for realizing the method. SOLUTION: An ultrasonic peeling-liquid jet nozzle 2, a peeling-liquid shower jet nozzle 3, and a solvent jet nozzle are provided. The evaporated metal film is physically peeled off by the peeling liquid to which ultrasonic power is superposed on its surface, and metal residuals and the resist are removed by jetting the peeling liquid of a raised temperature in a shower. Then, residuals of the resist are removed by jetting a solvent of a raised temperature in order to prevent residual organic coating films. COPYRIGHT: (C)2005,JPO&NCIPI |
