发明名称 |
Method for fabricating high frequency module |
摘要 |
This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.
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申请公布号 |
US2005037535(A1) |
申请公布日期 |
2005.02.17 |
申请号 |
US20040496878 |
申请日期 |
2004.05.26 |
申请人 |
OGAWA TSUYOSHI;KOSEMURA TAKAHIKO;MUTO AKIRA;OKUBORA AKIHIKO |
发明人 |
OGAWA TSUYOSHI;KOSEMURA TAKAHIKO;MUTO AKIRA;OKUBORA AKIHIKO |
分类号 |
H01L23/12;H01L23/498;H01L23/538;H01L23/64;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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