| 摘要 |
A bump transfer fixture for accommodating a plurality of bumps is provided. The bump transfer fixture includes a transfer plate having a plurality of fix structures. The plurality of fix structures are disposed on the surface of the transfer plate. Each of the plurality of fix structures accommodates one of the bumps. The fix structures can be concave or convex structures. By using the transfer plate to form the bumps, no photolithography technology is used to form the patterned photoresist layer. Hence, the bump transfer process is much simpler and faster. Therefore, the present invention effectively reduces the cost and time for the bump transfer process. |
