Base material, substrate and connection module

摘要

The thin copper foil (102) forms the core or mid-layer of the laminar substrate material (101). The total thickness of the laminar substrate material is 25 to 150 Micro. The copper foil has a regular array of perforations (104) and is 2 to 70 Micro thick. The perforations are especially at a standard pitch of 300, 500 or 800 Micro. The perforations may be 50 to 150 Micro in diameter.