SEMICONDUCTOR DEVICE TO MAKE ENDS OF INNER LEADS FURTHER APPROACH SEMICONDUCTOR CHIP MOUNTING REGION

摘要

PURPOSE: A semiconductor device is provided to make the ends of inner leads further approach a semiconductor chip mounting region by installing the ends of the inner leads near the entire of the semiconductor chip mounting region at regular intervals. CONSTITUTION: A substrate is prepared. A semiconductor chip(10) is mounted on one surface of the substrate, including an integrated circuit and a bonding pads. The integrated circuit is formed in the main surface of the quadrilateral type of the substrate. The bonding pads are disposed along the four sides of the main surface of the quadrilateral type. Several conductors are disposed on one surface of the substrate to surround the semiconductor chip along the four sides of the substrate. Several bonding wires(13) electrically connect the bonding pad with the end of the conductor. The semiconductor chip, the conductor and several bonding wires are encapsulated by resin. The pitch between adjacent bonding pads broadens as it goes to the four-corner direction defined by the four sides of the main surface of the semiconductor chip.