发明名称 Metal-free etching soln. for copper coatings
摘要 <p>Ammonium chloride and/or nitrate are used in a solution containing chloride and NH4OH. Pref. concentrations are chloride : 0.1 mol/l to saturation (specf. 0.375 mol/l); NH4 salt: 0.2 mol/l to saturation (spec. 1.5 mol/l); NH4OH: to pH 9.0 or above (spec. 3.0 mol/l). Alternatively the total chloride and/or nitrate concentration may be 1.0 mol/l and NH4HCO3 added to give 0.75 mol/l. The solution is pref. used (for etching printed circuits) at room temp. and as the copper in the solution builds up the temp. is gradually increased to 55 degrees C, with periodic NH4OH addition to maintain pH. When the amount of copper exceeds 45 g/l the solution may be aerated.</p>
申请公布号 NL6908722(A) 申请公布日期 1970.12.11
申请号 NL19690008722 申请日期 1969.06.09
申请人 发明人
分类号 C23F1/34;(IPC1-7):23F1/00 主分类号 C23F1/34
代理机构 代理人
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