发明名称 Very high bandwidth electrical interconnect
摘要 A very high bandwidth electrical interconnect for conducting signals at high frequency. The interconnect includes a number of separate fine wire structures. Each such fine wire structure is made up of a string of generally spherical elements, each such element having a ferromagnetic core and a conductive coating over the core. The interconnect also includes an insulating medium surrounding the wire structures.
申请公布号 US6854986(B2) 申请公布日期 2005.02.15
申请号 US20020289744 申请日期 2002.11.07
申请人 PARICON TECHNOLOGIES CORPORATION 发明人 WEISS ROGER E.
分类号 H01B7/30;H01B11/12;(IPC1-7):H01R4/58 主分类号 H01B7/30
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