发明名称 |
Very high bandwidth electrical interconnect |
摘要 |
A very high bandwidth electrical interconnect for conducting signals at high frequency. The interconnect includes a number of separate fine wire structures. Each such fine wire structure is made up of a string of generally spherical elements, each such element having a ferromagnetic core and a conductive coating over the core. The interconnect also includes an insulating medium surrounding the wire structures.
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申请公布号 |
US6854986(B2) |
申请公布日期 |
2005.02.15 |
申请号 |
US20020289744 |
申请日期 |
2002.11.07 |
申请人 |
PARICON TECHNOLOGIES CORPORATION |
发明人 |
WEISS ROGER E. |
分类号 |
H01B7/30;H01B11/12;(IPC1-7):H01R4/58 |
主分类号 |
H01B7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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