发明名称 Semiconductor device having aluminum alloy conductors
摘要 A semiconductor device is provided which includes a semiconductor substrate, metal conductors formed on a side of a main face of the substrate, which metal conductors contain aluminum as a main constituent thereof, and copper as an additive element, the metal conductors being made to contain such an element as to suppress the precipitation of copper or being made to have such a film adjacent to the metal conductor as to suppress the precipitation of copper or being made to have such a film adjacent to the metal conductor as to suppress the precipitation of copper.
申请公布号 US6856021(B1) 申请公布日期 2005.02.15
申请号 US20000648455 申请日期 2000.08.28
申请人 RENESAS TECHNOLOGY CORP. 发明人 IWASAKI TOMIO;MIURA HIDEO;NAKAJIMA TAKASHI;OHTA HIROYUKI;NISHIHARA SHINJI;SAHARA MASASHI
分类号 H01L21/28;H01L21/3205;H01L21/768;H01L23/52;H01L23/532;(IPC1-7):H01L23/52 主分类号 H01L21/28
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