发明名称 Manufacturing method of multilayer substrate
摘要 Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
申请公布号 US6855625(B2) 申请公布日期 2005.02.15
申请号 US20030458630 申请日期 2003.06.11
申请人 DENSO CORPORATION 发明人 KONDO KOJI;KAMIYA TETSUAKI;HARADA TOSHIKAZU;ONODA RYUICHI;KAMIYA YASUTAKA;MASUDA GENTARO;YAZAKI YOSHITARO;YOKOCHI TOMOHIRO
分类号 H05K3/28;H05K1/11;H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H01L21/47 主分类号 H05K3/28
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