发明名称 |
Wirebonding insulated wire |
摘要 |
An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength. |
申请公布号 |
US6854637(B2) |
申请公布日期 |
2005.02.15 |
申请号 |
US20030372061 |
申请日期 |
2003.02.20 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
HARUN FUAIDA;TIU KONG BEE |
分类号 |
B23K20/00;(IPC1-7):B23K31/00;B23K31/02 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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