Semiconductor devices and methods for fabricating the same

摘要

Disclosed are semiconductor devices and methods for fabricating the same. According to one embodiment, the method includes sequentially forming a gate insulation layer and a conductive layer on a semiconductor substrate. A buried impurity region is then formed in the semiconductor substrate. Thus, the gate insulation layer is formed before forming the buried impurity region, thereby substantially reducing impurity diffusion that can be caused by a thermal process for forming the gate insulation layer. In addition, the gate insulation layer is not exposed, thus protecting the gate insulation layer from being recessed.