| 发明名称 |
Lead frame, semiconductor device using the same and method of producing the semiconductor device |
| 摘要 |
A lead frame of the present invention includes a pair of base portions having a substantially flat bottom each. An island portion and electrode portions are partly connected to the tops of the base portions. The lead frame needs a minimum of production cost and promotes dense mounting of semiconductor devices to a circuit board.
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| 申请公布号 |
US2005032271(A1) |
申请公布日期 |
2005.02.10 |
| 申请号 |
US20040936795 |
申请日期 |
2004.09.09 |
| 申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
TANAKA TAKEKAZU |
| 分类号 |
H01L23/48;H01L23/31;H01L23/495;H01L23/50;(IPC1-7):H01L21/44;H01L21/50 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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