| 摘要 |
An integrated circuit device which comprises a substrate; drive circuitry arranged on the substrate; and a plurality of micro-electromechanical devices positioned on the substrate. Each micro-electromechanical device comprises an actuator connected to the drive circuitry, the actuator including a free end that is displaceable along a path relative to the substrate to perform work, and at least one arm capable of expansion when heated, the arm and the drive circuitry together defining a heating circuit, the arm being configured with respect to the substrate such that when the heating circuit receives an electrical signal from the drive circuitry, the arm expands and thus displace said free end along said path.
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