发明名称 |
Film laminating method and laminating apparatus |
摘要 |
In a film lamination method of the present invention, sound waves with a predetermined frequency are applied to at least one of a substrate or a film disposed on the substrate. Thus, by means of an acoustic vibration energy action, the adhesion of the film to the substrate and the quality of covering irregularities can be sufficiently enhanced and the embedding quality of the film to the irregular portions of the substrate can be achieved to a high standard.
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申请公布号 |
US2005028916(A1) |
申请公布日期 |
2005.02.10 |
申请号 |
US20040498065 |
申请日期 |
2004.06.09 |
申请人 |
TSUCHIYA KATSUNORI;OZAWA KYOUKO |
发明人 |
TSUCHIYA KATSUNORI;OZAWA KYOUKO |
分类号 |
B29C63/02;B29C65/08;(IPC1-7):B32B31/16;B32B31/00 |
主分类号 |
B29C63/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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