EPOXY RESIN COMPOSITION FOR SEALING AND ELECTRONIC PART DEVICE

摘要

An epoxy resin composition for sealing which comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a coloring agent and (E) an inorganic filler, wherein as the coloring agent (D), two or more selected from a black organic pigment, a phthalocyanine type compound and a titanium based black pigment are contained in the composition respectively in an amount of 0.01 to 1.0 wt %. An electronic part device sealed by using the epoxy resin composition for sealing being excellent with respect to the durability in insulation is reduced in the occurrence of the failure of electric characteristics, and further is excellent in its appearance and the sensitivity to a laser such as YAG.