发明名称 LASER BEAM MACHINING METHOD, LASER BEAM MACHINING DEVICE, MANUFACTURING METHOD FOR LIQUID DROPLET DISCHARGE HEAD, AND LIQUID DROPLET DISCHARGE HEAD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method in which scattering matters of one member are not adhered to the surface of a workpiece even if one member is cut along a boundary line (a projection line) by the end face of the other member with the irradiation of a laser beam to one member along the end face of the other member, and to also provide a laser beam machining device, a manufacturing method for a liquid droplet discharge head, and a liquid droplet discharge head. <P>SOLUTION: A first member 201 is cut with the irradiation of the laser beam 26 to the workpiece 203, which is provided with the first member 201 and a second member 202 arranged on the upper side of the first member 201, along the end face 212 of the second member 202. The laser beam 26 has a higher absorption factor to the first member 201 compared with that of to the second member 202. The irradiation of the laser beam is executed in a state of exposing at least either of the upper face and the lower face of the workpiece 203 to a liquid flow. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005034862(A) 申请公布日期 2005.02.10
申请号 JP20030198901 申请日期 2003.07.18
申请人 SEIKO EPSON CORP 发明人 NAKAZAWA YOICHI;UMETSU KAZUNARI;SAWAKI DAISUKE
分类号 B41J2/16;B23K26/00;B23K26/12;B23K26/20;B23K101/40;B41J2/045;B41J2/055;(IPC1-7):B23K26/00 主分类号 B41J2/16
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