摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device mounting a fuse capable of blowing out with a current or a voltage smaller or lower than that for a conventional fuse. SOLUTION: A conductor constituting a fuse 100 is formed into a multiple-folded shape. It becomes more likely that heat accumulates at a rectilinear part 104 sandwiched by rectilinear parts 103 and 113 on the current input side and current output side of the conductor formed in the conductive material when a current flows through the fuse and the conductor is easily blown out. COPYRIGHT: (C)2005,JPO&NCIPI |