发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device mounting a fuse capable of blowing out with a current or a voltage smaller or lower than that for a conventional fuse. SOLUTION: A conductor constituting a fuse 100 is formed into a multiple-folded shape. It becomes more likely that heat accumulates at a rectilinear part 104 sandwiched by rectilinear parts 103 and 113 on the current input side and current output side of the conductor formed in the conductive material when a current flows through the fuse and the conductor is easily blown out. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005039220(A) 申请公布日期 2005.02.10
申请号 JP20040168131 申请日期 2004.06.07
申请人 NEC ELECTRONICS CORP 发明人 UEDA TAKEHIRO
分类号 H01L23/52;H01L21/3205;H01L21/82;H01L21/822;H01L23/525;H01L27/04;(IPC1-7):H01L21/82;H01L21/320 主分类号 H01L23/52
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