| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for the interlayer insulation layers of a multilayer printed wiring board and adhesive films having excellent mechanical strength and capable of being roughened with an oxidizing agent. SOLUTION: This resin composition for the interlayer insulation layers of a multilayer printed wiring board contains: (a) one or more heat-resistant resins soluble in organic solvents and selected from the group consisting of a polyimide resin, a polyamide-imide resin, a polyamide resin, a polyether imide resin, a polybenzoxazol resin, a polybenzimidazole resin, (b) a thermosetting resin, (c) a filler, and (d) a resin having a polybutadiene skeleton and/or a polysiloxane skeleton. The weight ratio of the components (a) to (b) is in a range from 100:1 to 1:1, the weight ratio of the sum of the components (a) and (b) to the component (c) is in the range from 100:1 to 3:2, the mixing amount of the component (d) is in the range from 0.1 to 15 parts by weight based on 100 parts by weight of the component (a), and total mixing amount of the components (a) to (d) is 70 wt.% or more. COPYRIGHT: (C)2005,JPO&NCIPI |
