发明名称 HEATSINK DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heatsink device for a flat package which is easily mounted on or dismounted from the flat package and enables an operator to easily ascertain the state of the leads of the flat package or to easily correct the failures in the leads even after the heatsink device is mounted on the flat package. SOLUTION: The heatsink device is equipped with a plurality of heat dissipating fins and L-shaped fixing pins 12 and 13 extending from near the side faces of a heat dissipating unit 11, and a thermally conductive double-sided tap 14 is pasted on all the abutting face 21 of the heat dissipating unit 11. Through-holes 4 and 5 with lands where the fixing pins 12 and 13 are inserted are bored in the wiring board 3 of the flat package 2 near the mounting position. After the fixing pins 12 and 13 are inserted into the through-holes 4 and 5, the abutting face 21 nearly equal in size to the top surface 41 of the flat package 2 is attached to the top surface 41 with the double-sided tape 14 so as not to get out of position, and the heatsink device is fixed on the printed wiring board by soldering. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005038878(A) 申请公布日期 2005.02.10
申请号 JP20030197017 申请日期 2003.07.15
申请人 YAMAHA CORP 发明人 TANABE HIROYUKI
分类号 H05K7/20;H01L23/36;H01L23/40;(IPC1-7):H05K7/20 主分类号 H05K7/20
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