| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that warpage occurs in the disk formed substrates loaded in the conventional loading mechanism for the disk formed substrates which loads and cools the disk formed substrates in a horizontal state. SOLUTION: The loading mechanisms 1, 11, 21, and 31 for the disk formed substrates D which load the disk formed substrates D each having a central hole D 3 of a diameter 15 mm in the horizontal state are formed with the signal surfaces D 4 of the disk formed substrates D or inner peripheral surfaces D 5 and D 9 on the inner peripheral side from the boundaries with the surfaces facing the front and rear of the signal surfaces in such a manner that loading sections 5, 19, 25, and 36 having an area of 3.8 to 35.8% of the area of inner peripheral surfaces D 5 and D9 are made to abut on the inner peripheral surfaces. COPYRIGHT: (C)2005,JPO&NCIPI
|
