| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing light emitting elements, that is improved in radiant light intensity and luminance by satisfactorily maintaining the profile irregularity of a reflecting surface provided around the light emitting element at a desired level, by effectively preventing the light emitted from the element from being absorbed and transmitted by the top surface of a substrate, and, at the same time, preventing the distortion of a reflecting member caused by heat; and to provide a light emitting device. <P>SOLUTION: The package for housing light emitting elements is provided with a substrate 2 having a placing section 2a for placing the light emitting element 1; and a frame-like reflecting member 3 which is joined to the top surface of the substrate 2 to surround the placing section 2a, and the inner peripheral surface of which is inclined so that the surface may be expanded to the outside as going toward the top side and constituted in a reflecting surface 3a which reflects the light emitting from the light emitting element 1. The placing section 2a is protruded from the top surface of the substrate 2 and, at the same time, the side face of the section 2a is in contact with the lower end of the inner peripheral surface of the reflecting member 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
