发明名称 |
Method for the inspection of features on semiconductor substrates |
摘要 |
A method for the inspection of features of semiconductor substrates is disclosed. Once an image of a semiconductor substrate has been acquired, ROIs are allocated to pattern elements. Various parameters for evaluation of the acquired image of the semiconductor substrate are assigned to the ROIs. The ROI assigned to one pattern element of the semiconductor substrate is automatically transferred to corresponding pattern elements of the semiconductor substrate in the other elements.
|
申请公布号 |
US2005031189(A1) |
申请公布日期 |
2005.02.10 |
申请号 |
US20040886596 |
申请日期 |
2004.07.09 |
申请人 |
LEICA MICROSYSTEMS SEMICONDUCTOR GMBH |
发明人 |
RICHTER JORG |
分类号 |
H01L21/66;G01N21/95;G06T7/00;(IPC1-7):G06K9/00 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|