| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging method of an electronic component which reduces remarkably packaging processes and can mount adjacently a passive component and a semiconductor component. SOLUTION: The packaging method of the electronic component is composed of a process for applying soldering paste 7 to the prescribed position of an electrode formed on a circuit substrate 1 and performs the precoating of the solder, a process for applying a thermosetting adhesive 13 on the circuit substrate 1 on which the solder is precoated, a process for making the electrode and a bump electrode 14 formed in a semiconductor component 2 face each other and performing alignment and temporary stopping, a process for mounting a passive component on the electrode precoated with solder, and a process for hardening simultaneously and connecting the bump electrode 14 and precoated solder and the thermosetting adhesive 13. The passive components 9, 10 and the semiconductor component 2 are connected and fixed by the same material, so that a man-hour in a manufacturing process can be remarkably reduced and the passive components 9, 10 and the semiconductor component 2 can be connected further adjacently. COPYRIGHT: (C)2005,JPO&NCIPI
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