| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip surface mounting method which requires no packaging material for intermediate stage movement of the semiconductor chips, and simplifies the processes without additional underfill process required, to reduce the separation between components. <P>SOLUTION: The surface mounting method includes steps of forming a solder bump at a conductive contact portion of each semiconductor on a rear face of a semiconductor wafer where a plurality of the semiconductor chips are integrally arranged, coating an underfill material on the surface in which the solder bump of the semiconductor wafer is formed, hardening the underfill material partially in a state of retaining adhesiveness, arranging the semiconductor chips on a printed circuit board so that the underfill material may be confronted with the printed circuit board after severing the semiconductor wafer by a plurality of the semiconductor chips, and heating the printed circuit board at a predetermined temperature. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
