| 摘要 |
Abstract of the Disclosure There is provides a multi-layer conductive/insulation pad is provided having a first polymer layer, a conductive layer such as a thin foil of metal or a metallized thermoplastic film laminated to the first polymer layer, a second polymer layer laminated to the side of the conductive layer opposite the side of the first polymer layer, and a first bubble wrap layer. The first bubble wrap layer is laminated to the side of the second polymer film opposite the conductive layer. Optionally, a protective heavy-duty polymer layer is laminated to the first bubble wrap layer on the opposite side of the second polymer layer. In another embodiment the multi-layer construction of pad of the first embodiment has added thereto a third polymer layer laminated to the side opposite the first layer of bubble wrap and a second layer of bubble wrap laminated to the third polymer layer on the side opposite the first bubble wrap. Optionally, a protective heavy-duty polymer layer is laminated to the first bubble wrap layer on the opposite side of the second polymer layer.
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