| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure wherein a connection device is cooled efficiently, concerning the electrical connection device used for an energization test of a plurality of integrated circuit regions formed on a semiconductor wafer. SOLUTION: In this electrical connection device, a frame is arranged on the lower side of a card substrate equipped with a plurality of first connection parts on the under surface, and a plurality of probe substrates equipped respectively with a plurality of second connection parts are arranged flatly on the frame, and a plurality of probes are arranged on the lower side of each probe substrate, and the first and second connection parts are connected in one-to-one relation by a wiring substrate arranged between the card substrate and the probe substrates. Wiring of a connection substrate is extended in the vertical direction. COPYRIGHT: (C)2005,JPO&NCIPI
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