| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of producing electronic components provided with a process in which plating films can securely be formed on electronic components even which are compact, when the electronic components, electroconductive media and insulator powders are stored into a vessel and plating is performed as vibration is applied to the vessel, while suppressing defects caused by the fusion and bonding of the electronic components and the fusion and bonding of the electroconductive media. SOLUTION: In the method of producing electronic components, when many electronic components, electroconductive media and spherical insulator powders are stored into a vessel and, in a state where the vessel is dipped into a plating liquid, and electroplating is applied to the electronic components as the vessel is vibrated, the plating is performed in such a manner that the volume of the plurality of insulator powders stored into the vessel is controlled into the range of 40 to 65% to the volume of the electronic components and electroconductive media. COPYRIGHT: (C)2005,JPO&NCIPI
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