| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which has good moldability such as flowability and curability and can reduce the quantity of deformation in warpage even when used in a single-sided sealing package of a batch mold type, and an electronic part device equipped with an element sealed therewith. SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler as essential components, and when the molding material is molded at 180°C for 90 seconds and the obtained cured product is further post-cured at 180°C for 5 hours, the dimension of the cured product at 25°C expands≥0.05% before and after the post-curing. COPYRIGHT: (C)2005,JPO&NCIPI
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