发明名称 Multi-functional solder and articles made therewith, such as microelectronic components
摘要 Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.
申请公布号 US2005029667(A1) 申请公布日期 2005.02.10
申请号 US20040932585 申请日期 2004.09.01
申请人 YAMASHITA TSUYOSHI;JIANG TONGBI 发明人 YAMASHITA TSUYOSHI;JIANG TONGBI
分类号 B23K1/00;B23K35/02;B23K35/26;B23K35/36;H01L21/60;H01L23/485;H01L23/488;H05K3/34;(IPC1-7):H01L23/48 主分类号 B23K1/00
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