发明名称 |
Multi-functional solder and articles made therewith, such as microelectronic components |
摘要 |
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation. |
申请公布号 |
US2005029667(A1) |
申请公布日期 |
2005.02.10 |
申请号 |
US20040932585 |
申请日期 |
2004.09.01 |
申请人 |
YAMASHITA TSUYOSHI;JIANG TONGBI |
发明人 |
YAMASHITA TSUYOSHI;JIANG TONGBI |
分类号 |
B23K1/00;B23K35/02;B23K35/26;B23K35/36;H01L21/60;H01L23/485;H01L23/488;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
B23K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|