| 发明名称 |
TRÄGERLOSES POLIERBAND ZUM CHEMISCH-MECHANISCHEN POLIEREN |
| 摘要 |
<p>A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.</p> |
| 申请公布号 |
DE60017271(D1) |
申请公布日期 |
2005.02.10 |
| 申请号 |
DE2000617271 |
申请日期 |
2000.08.31 |
| 申请人 |
LAM RESEARCH CORP., FREMONT;PERIPHERAL PRODUCTS INC., SALEM |
发明人 |
XU, CANGSHAN;LOMBARDO, S. |
| 分类号 |
B24B21/00;B24B37/20;B24B37/26;B24D7/12;B24D11/00;B24D18/00;H01L21/304;(IPC1-7):B24D11/00;B24B37/04 |
主分类号 |
B24B21/00 |
| 代理机构 |
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代理人 |
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