| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which occurrence of a broken part is suppressed even if the pressure inside a sealing member is increased by heating, wherein the method has a process of sealing the semiconductor device by mounting a sealing member on a substrate on which the semiconductor device element is mounted. SOLUTION: In the method of manufacturing a semiconductor device, an optical sensor element 11 is sealed by tightly gluing a holder 13 to the substrate 12 on which the optical sensor element 11 is mounted, wherein a vent hole 25 is formed in the holder 13. The vent hole 25 is closed after the holder 13, in which the vent hole 25 has been formed, is tightly glued to the substrate 12, to seal the optical sensor element 11 air-tight. COPYRIGHT: (C)2005,JPO&NCIPI |
