| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device advantageous for the multi-pin configuration and mountable easily on a wiring board in which a bump electrode is protected against the fatigue fracture due to the difference in thermal expansion coefficients between the semiconductor device and the wiring board. SOLUTION: The semiconductor device comprises first bonding pads 2 arranged along the outer circumferential part of a major surface 1, a passivation film 3 formed on the major surface 1 excepting the part for forming the first bonding pads 2 in order to protect the major surface 1, a first insulating film 4 formed on the passivation film 3, reinterconnect lines 5 formed on the first insulating film 4 and having one end connected with the first bonding pad 2, a second insulating film 6 formed on the first insulating film 4 in order to protect the reinterconnect lines 5, and bump electrodes 8 and 8a set on second bonding pads 7 formed on the other end of the reinterconnect lines 5. At least the bump electrodes 8a being arranged at four corner parts of the major surface are formed of a soft conductive material and other bump electrodes 8 are formed of a hard conductive material. COPYRIGHT: (C)2005,JPO&NCIPI
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