FLIP-CHIP COMPONENT PACKAGING PROCESS AND FLIP-CHIP COMPONENT
摘要
A flip-chip package comprises a substrate having at least one layer and a component flip-chip mounted to the substrate, the component having a field termination ring. The flip-chip package further comprises a shield plane interposed between the at least one layer of substrate and the field termination ring.
申请公布号
WO2004075294(A3)
申请公布日期
2005.02.10
申请号
WO2004US04040
申请日期
2004.02.12
申请人
MEDTRONIC INC.;BOONE, MARK, R.;FENNER, ANDREAS, A.;MILLA, JUAN, G.;LARSON, LARY, R.
发明人
BOONE, MARK, R.;FENNER, ANDREAS, A.;MILLA, JUAN, G.;LARSON, LARY, R.