| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC label that meets high durability and anti-water pressure characteristics. <P>SOLUTION: The IC label has a basic portion 2 of a flat IC chip package with an upper and lower surface, having an antenna circuit connected with the IC 6 (hereinafter to be referred to as the basic portion 2); an upper surface side layer group 21, having the watertight covering layer of a stress relaxation adhesive layer 16, waterproof barrier layer 1 and watertight covering layer 14, which cover at least the entire upper surface of the basic portion 2 and have surplus portions A, B so as to be positioned at the surface side at least; and a fixed part, which is a watertight fixed part, covering at least the entire lower surface of the basic portion 2 and having a surplus portion C of the fixed part, having an adhering surface to an adherend on the surface opposite to the surface covering the basic portion 2. Part of the surplus portion of the upper surface side layer group is bonded with part of the surplus portion of the fixed part so as to seal the circumference of the basic portion 2, and the adhering surface of the lower fixed part to the adherend is substantially flattened, by recessing the surplus portion of the upper surface side layer in the periphery, thereby enabling the stable adhesion to the adherend even under water pressure. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
