POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, SEMICONDUCTOR DEVICE, DISPLAY ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which can be developed with high sensitivity without scum and gives a slightly colored film having low water absorption after curing, and to provide a method for manufacturing a semiconductor device and a display element using the same.

SOLUTION: The positive photosensitive resin composition contains an alkali-soluble resin (A), a diazonaphthoquinone compound (B) and a compound (C) containing -CH2OH but not containing a phenolic hydroxyl group, wherein the alkali-soluble resin (A) is preferably a polyamide resin having a specified structure and the compound (C) preferably has two or more -CH2OH groups.

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