| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, at the time of reflow connection with a mother board, solder is remelt, causing short-circuiting between the electrodes in a conventional module with built-in electronic components which uses solder for mounting the electronic components and is molded with resin. SOLUTION: The module 1 with built-in electronic components includes at least one electronic component 4 and a wiring board 2 having at least one interconnection layer. The electronic component 4 is connected to electrodes 3 of the wiring board 2 by solder 5, and all these are covered with insulating resin 7, and an electromagnetic shield layer 15 which consists of a metal plating film is formed on the surface of the insulating resin 7. In such module 1 with built-in electronic components, S<SB>C</SB>≥S<SB>S</SB>is satisfied, where S<SB>C</SB>is an interval between electrodes 6 of the electronic component 4 and S<SB>S</SB>is an interval between the electrodes 3 of the wiring board 2 for mounting the electronic component. COPYRIGHT: (C)2005,JPO&NCIPI
|
